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　　NVIDIA大家应该都听过吧。。。下面的职位列表都是最新的，2月24日更新。最近市道比较好，Tegra芯片卖得很多，显卡市场也做得不错，公司发展得比较好，需要招人（主要是招有经验的，工作地点在深圳和天津两个地方）,　　有论坛的朋友想跳槽吗？工资待遇算很不错的，新员工一进来也有15天带薪年假，上下班不打卡，比较少加班。基本都是9点半上班，6点下班的样子。好多职位都有机会去美国总部做技术支援。,　　觉得合适的朋友可以把简历发到bpan@nvidia.com，可以帮忙内推。之前做过相关工作经验的，进来还是不难的。有什么问题也可以发邮件问我，上班不是很忙的话很快就回你。,　　PS：之前论坛上有不少朋友发简历给我，有好多已经面试过了，有一个朋友还收到OFFER了。所以内推进来的几率还是挺高的。,　　招聘的职位有：,　　SDM--component Engineer--China, Shenzhen,　　SDM--Test Engineer---China, Shenzhen,　　SW---System Software Engineer---China, Shenzhen,　　SDM---Mobile Device Design Engineer---China, Shenzhen,　　SDM---Product Failure Analysis Engineer---China, Shenzhen,　　SDM---EDA Development Engineer---China, Shenzhen,　　SDM---Automotive Production Engineer---China, Shenzhen,　　SW---System Design Engineer---China, Shenzhen,　　SDM---Senior Automotive Manufacturing Engineer---China, Shenzhen,　　SW---System Software Engineer - Android---China, Shenzhen,　　SDM---Manufacturing Quality Engineer---China, Shenzhen,　　SDM---Mobile Manufacturing Test Engineer---China, Tianjin,　　SDM---Automotive Supplier Quality Engineer---China, Tianjin,　　SDM---Manufacturing Manager---China, Tianjin,　　部分职位描述：,　　Job Title: Mobile Device Design Engineer,　　Department: SDM,　　Location: China, Shenzhen,　　Number of Openings: 1,　　Job Description/Qualifications:,　　Responsibilities:,　　? Hardware Design for Tegra-based Tablet and Smartphone,　　? Board/System level circuit reSearch and Development,　　? Schematic concept design, component selection and Bill of Material generation,　　? Board/system level Hardware debug and verification,　　? Responsible for product design issue in overall life time cycle,　　? Guide PCB layout engineer for placement, power and high speed signals routing,　　? Guide design Validation engineer for signal measurement,　　? Co-work with mechanical engineer for system stackup,　　? Co-work with SWQA and HWQA team for system stability test,　　? Co-work with core SW team on Tablet and smartphone debug,　　Minimum Requirement:,　　? BS/MSEE AND 4+ years of smartphone or tablet design experience,　　? Experience with high speed board design techniques,　　? Experience with ARM architecture, Andriod,iOS or other mobile OS,　　? Experience with design tools (such as OrCad, Concept, Allegro, etc.),　　? Experience working with the following:,　　-PCB layout designers,　　-Smartphone or tablet fabrication and assembly,　　-Board/system level bring-up, debug, and verification,　　- Proven ability to deliver complex projects from specification through to production,　　- Experience with the following:,　　Design for Manufacturing,　　Design for compliance (EMI, Safety),　　Signal Integrity,　　Job Description/Qualifications: System Software Engineer,　　Tegra MODS development,　　RESPONSIBILITIES:,　　- Develop diagnostic software for our cutting-edge SOC systems.,　　- The driver-like software will be used in the full life cycle of Tegra including ASIC design, chip bring-up, board screening and diagnostics.,　　- Drive diagnosis of chip and board issues with hardware, software, and operations engineering.,　　- Capture & analyze HW failures and implement requirements coming from the customers and users.,　　Requirements:,　　BS or MS degree in EE/CS/CE,　　Strong C/C++ programming skills,　　Experienced with low level / driver level programming Linux / Android kernel development experienced preferred,　　knowledge of ARM / SOC will be an advance,　　EDA development engineer,　　As the EDA engineer, this job will mainly focus on EDA tools development and maintenance, use Allegro skill, Perl, Java, CUDA and C++ languages to improve PCB design efficiency and quality, improve Concept HDL design efficiency and quality, Improve substrate design efficiency and quality and work on tasks to optimize our design flow.,　　Qualifications:,　　- Bachelor or Master Degree in Electronics/Software/Computer Engineering and 3+ years of software development,　　- Rich experience with allegro skill language,　　- Rich experience with C++, Java and Perl, CUDA is a plus,　　- Be familiar with EDA software, e.g. Cadence, Valor; know the softwares structure;,　　- Be familiar with PCB design,　　- Experience on EMC design, High speed theory, power theory,,　　- Be familiar to manufacture rules, know some software such as Valor, CAM,　　- Can do attitude,　　- High energy, Ability to learn complex process and concept in a fast pace environment,　　- Quick thinking and good decision making skills,　　- Good communication skills (Written and oral English),　　Job Title: Test Engineer,　　Department: SDM,　　Number of Openings: 1,　　Location: China, Shenzhen,　　Job Description/Qualifications:,　　Responsibilities:,　　? Test Engineer responsible for successful accomplishment of Modular Diagnostic Software (MODS) production validation activities for Tegra-based Automobile electronics products.,　　Minimum Requirements:,　　? Possess a university degree or above in electrical, electronic, computer or industrial engineering, or equivalent.,　　? Has 3 years or above of relevant work experience in electronics manufacturing / product development environment.,　　? Be able to communicate well in spoken and written English.,　　? Demonstrates ability to describe workflow and prepares draft in form of procedure/plan.,　　? Has hands-on experience in operating various computing environments, such as DOS, UNIX/Linux, Windows (98, NT, XP, Vista),　　? Has hands-on debug experience on hardware electronics circuits with the help of diagnostics software.,　　RELEVANT EXPERIENCES / QUALITIES VALUABLE TO THIS POSITION:,　　- Those who can demonstrate sound experience over test aspects during product development / manufacturing of electronics products serving international Automobile companies will be given a priority consideration.,　　- An advantage for those who have relevant work experience in product test aspects for other general electronic products, including computer-related, mobile communications, networking devices, etc.,　　- Understands the basic of graphics hardware functions in GPU, VGA, TMDS, TIVO, video memory, etc.,　　- Understands the basic functionality of motherboards such as CPU, memory, PCI Bus, PCIe Bus, SATA, USB, etc.,　　- Knowledge and first-hand, in-depth experience using various NVIDIA products,　　- Feels comfortable interacting with foreigners,　　Position Title: Product Failure Analysis Engineer,　　Description/,　　Qualifications: Job Description:,　　- Handle escalated FA from factory or NVIDIA FA personnel,　　- Perform board failure analysis on graphics boards down to component level,　　- Provide root cause and corrective action in a timely manner,　　- Write clear and complete FA reports detailing steps taken and findings,　　- Work closely with factory personnel and NVIDIA program managers on production issues,　　- Work with NVIDIA Quality department on DPPM improvement,　　- Ability to communicate with engineer, factory personnel and cross-functional teams,　　Qualifications:,　　- Hands-on experience in troubleshooting PCBA down to component level,　　- BSEE or equivalent in related technical field,　　- Excellent problem solving and troubleshooting skills,　　- Able design experiments and collect/analyze data for FA,　　- Able to perform under deadline pressure,　　- Good communication skills,　　- Self starter,　　- Working knowledge of advanced test equipment (oscilloscopes, logic analyzer, etc.),　　- Located in LongHua, Shenzhen,　　Special Notes: location also can be HK, company will provide relocated package.,　　Job Title: Component Engineer,　　Department: SDM.,　　Location: Shenzhen, China,　　Number of Openings: 1,　　Job Description/Qualifications:,　　Responsibilities:,　　? Creating Component Specifications for commonly used parts to assist in multi-sourcing.,　　? Review the electrical attributes of new components and correct the wrong attributes of components in library.,　　? Standardize the components spec.,　　? Review the schematic for components usage.,　　? Review the components and uniform the spec in library.,　　? Create logic symbol for new components.,　　? Interface to design engineer, mechanical engineer, sourcing team, SQE and suppliers.,　　? Create part number for design.,　　? Survey the quality/performance/supporting issue of components/suppliers and provide a score.,　　Minimum Requirements:,　　? 3+ years in component engineering or design engineering.,　　? Understanding the component usage, technology and industry Standard.,　　? Understanding of electrical engineering concept.,　　? Understanding the electronics manufacture.,　　? Background in PC high-volume APPlications.,　　? Experience with Excel and Word.,　　? Experience Cadence concept or other electronics design tool.,　　? Good written and verbal communication skills in English.,　　Job Title: Customer Quality Engineer,　　Department: Chip-Ops,　　Number of Openings: 1,　　Location: China, Shenzhen,　　Job Description/Qualifications:,　　Responsibilities:,　　? Drive the Line Data Accuracy and FA CND Rate Reduction,　　- On-site socket board verification frequently ( e.g. twice /week),　　- Ensure proper Socket Board Usage,　　- Identify overclocked / super-guard band SKU,　　- On-site FA and first line triage of quality issues from IQC / SMT / ICT / FCT / OQA / ORT / RMA.,　　- Manage urgent recovery activities to quality excursion / line-down / urgent customer issues.,　　? Drive Quality / RMA improvement,　　- Continuously review, analyze and report customer yield and RMA information to internal teams,　　- Coordinate and conduct customer line audits when needed.,　　- Manage FA activities on field return issues.,　　? Manage customer complaints and responses (status tracking / reporting / documentation),　　- Ensure effective communication of information between customer and FA / engineering teams.,　　- Formulate complaint containment, updates, corrective actions, and closure.,　　- Focal point of customer complaint escalations and voice of customer.,　　? Station in Tianjin,　　Minimum Requirements:,　　? Bachelor degree or above (Electronics/Computer Engineering related),　　? Experience in customer support and SMT process.,　　? Experience in SMT process.,　　? Experience in Mobile Support, testing, troubleshooting processes.,　　? Good verbal and written communication skills in English and Chinese,　　? Good communication skills,　　? Willing to overtime work and frequent travel,　　Job Title: Component Engineer,　　Department: SDM.,　　Location: Shenzhen, China,　　Number of Openings: 1,　　Job Description/Qualifications:,　　Responsibilities:,　　? Creating Component Specifications for commonly used parts to assist in multi-sourcing.,　　? Review the electrical attributes of new components and correct the wrong attributes of components in library.,　　? Standardize the components spec.,　　? Review the schematic for components usage.,　　? Review the components and uniform the spec in library.,　　? Create logic symbol for new components.,　　? Interface to design engineer, mechanical engineer, sourcing team, SQE and suppliers.,　　? Create part number for design.,　　? Survey the quality/performance/supporting issue of components/suppliers and provide a score.,　　Minimum Requirements:,　　? 3+ years in component engineering or design engineering.,　　? Understanding the component usage, technology and industry Standard.,　　? Understanding of electrical engineering concept.,　　? Understanding the electronics manufacture.,　　? Background in PC high-volume APPlications.,　　? Experience with Excel and Word.,　　? Experience Cadence concept or other electronics design tool.,　　? Good written and verbal communication skills in English.,　　Job Title: Automotive Production Engineer,　　Department: SDM,　　Location: China, Shenzhen,　　Number of openings: 1,　　Job Description/Qualifications:,　　Responsibilities:,　　- Board failure condition analysis,　　- Mods test coverage analysis,　　- Design and create test plans for automotive board tests.,　　- Debug and investigate automotive production failure issues.,　　- Work with design team and feedback any design issue or improvement.,　　Minimum Requirements:,　　- BSEE or MSEE required.,　　- Candidate with 3+ years of experience in related field is preferred.,　　- Must have the ability to work well in a team environment and have good written and verbal communication skills.,　　- Automotive experience a plus.,　　Job Title: System Software Engineer – Android;,　　Senior System Software Engineer - Android,　　Department: SW-TEGRA,　　Location: China, Shenzhen,　　Number of Opening: 2,　　Job Description/Qualifications:,　　Responsibilities:,　　NVIDIA is hiring a (senior) software engineer to work in our Tegra software organization, for Android platform R&D. Ideal candidates will have a thorough understanding of operating system internals (preferably Linux) and microprocessor architecture, and are capable of understanding complex hardware and program optimize on embedded footprints. Understanding of power / performance and bottlenecks in typical system architecture will be a plus.,　　RESPONSIBILITIES:,　　- Specify software requirements and influence the hardware design for embedded projects.,　　- Design and implement software platform support, including kernel modifications / extensions, driver support, and tools / test development.,　　- Work with hardware architects on the design of embedded products, providing feedback and guidance on CPU, bus, and device design to ensure that it can be supported well by software.,　　MINIMUM REQUIREMENTS:,　　- BS or MS degree in EE/CS/CE,　　- Excellent C programming and debugging skills.,　　- Experience in software architecture and design, particularly in the embedded space.,　　- Experience with embedded operating (esp. Android, Linux) is a major plus.,　　- Experience with 3D graphics or multimedia is a major plus.,　　- Ability and flexibility to work and communicate effectively in a multi-national, multi-time-zone corporate environment.,　　For senior opening, require BS+5 year experience, MS+3 year experience.,　　Job Title: Manufacturing Quality Engineer,　　Department: SDM,　　Location: China, Shenzhen,　　Number of Openings: 1,　　Job Description/Qualifications:,　　RESPONSIBILITIES:,　　? Monitoring the daily yield data for production line.,　　? Identifying whether manufacturing problem for the test failures and fix it.,　　? Working with CM engineer for continuous improvement on process and product yield.,　　? Daily review meeting during the yield rate low than target.,　　? Create necessary bug and CAR to track all the critical quality issue.,　　? Managing manufacturing and quality issue in production line, identifying process, material, design& test program issue.,　　? Managing tooling and fixture development/support.,　　? Leading root cause analysis and corrective action on process and quality issue.,　　? Daily audit for production line.,　　? Escalate critical quality issue to engineering team and high management,　　MINIMUM REQUIREMENTS:,　　? Bachelor Degree in an Engineering discipline (i.e., Electrical, Industrial, or Mechanical).,　　? 5+ years manufacturing management experience in computer electrical product.,　　? Competence with spoken and written English.,　　? Familiarity with electrical product SMT, wave-soldering, assembly, rework process.,　　? Familiarity with IPC-A-610 Acceptability of Electronic Assemblies.,　　? Familiarity with ICT, function test process.,　　? Know about process failure analysis tool.(i.e., X-ray, microscope, ERSASCOPE, cross section, and dye&pry??),　　? Know about ESD&EOS of ESD20.20 for computer product.,　　? There is knowledge for DFX, DOE, FMEA.,　　? Active feedback sense and good communication skill for manufacturing and quality issue,　　Job Title: Senior Automotive Manufacturing Engineer,　　Department: SDM,　　Location: China, Shenzhen,　　Job Description/Qualifications:,　　Responsibilities:,　　- Auditing CM (Contract Manufacturer) manufacturing process, testing process and quality systems for compliance with NVIDIA requirements for automotive products.,　　- Providing technical expertise of manufacturing assembly and process technologies to CM engineering teams from NPI through mass production, EOL and RMA process.,　　- Daily monitoring performance through gathering relevant production data and generating statistical reports.,　　- Investigating operational problems affecting production. Troubleshooting and identifying root cause of factory line failures. Interfacing with internal teams to quickly and effectively contain any type of production issues. Maintaining failures and scrap inventory.,　　- Regular review meeting with CM, and be responsible for ensuring execution of corrective actions and ongoing quality improvements at CM.,　　- Following up customer quality issues through factory and providing action plans.,　　MINIMUM REQUIREMENTS:,　　- Bachelor degree or above, major in mechanical / electronic engineering.,　　- Good English in both writing and speaking.,　　- Rich manufacturing process engineering experience in automotive products of the following areas: PCBA SMT/assembly and rework.,　　- Familiarity with PCB types and finishes, IC packages, BGAs mounting and rework methods.,　　- Familiarity with automotive process documentation, APQP, PPAP and IMDS etc.,　　- Certified with IPC-A-610 class III.,　　- Well trained and Certified with TS16949,,　　- Knowledge of automotive products testing is a plus too.,　　PS：之前论坛上有不少朋友发简历给我，有好多已经面试过了，有一个朋友还收到OFFER了。所以内推进来的几率还是挺高的。,　　觉得合适的朋友可以把简历发到bpan@nvidia.com，可以帮忙内推。之前做过相关工作经验的，进来还是不难的。有什么问题也可以发邮件问我，上班不是很忙的话很快就回你。,　　NVIDIA大家应该都听过吧。。。下面的职位列表都是最新的，2月24日更新。最近市道比较好，Tegra芯片卖得很多，显卡市场也做得不错，公司发展得比较好，需要招人（主要是招有经验的，工作地点在深圳和天津两个地方）